{"id":3650,"date":"2023-11-20T09:32:00","date_gmt":"2023-11-20T00:32:00","guid":{"rendered":"https:\/\/agus.co.jp\/en\/?p=3650"},"modified":"2024-07-09T10:47:56","modified_gmt":"2024-07-09T01:47:56","slug":"explanation-of-the-differences-between-ald-cvd-and-sputtering-introducing-the-types-and-characteristics-of-deposition","status":"publish","type":"post","link":"https:\/\/agus.co.jp\/en\/?p=3650","title":{"rendered":"Explanation of the differences between ALD, CVD and sputtering. Introducing the types and characteristics of deposition!"},"content":{"rendered":"\n
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The ‘deposition’ technology is essential in the manufacturing process for the smartphones, PCs, cars, semiconductors and other products we use.<\/p>\n\n\n\n

Invisible coating technologies support our daily lives.<\/p>\n\n\n\n

As there are many different types of deposition, this article introduces a summary of the different types of deposition and their characteristics.<\/p>\n\n\n\n

List of deposition types and characteristics<\/h2>\n\n\n\n

A variety of equipment and methods are available for deposition, including vapor deposition, sputtering and chemical vapor deposition (CVD) and spin coating.<\/p>\n\n\n\n

Even in the deposition of the same substance, the properties may vary depending on the method used.<\/p>\n\n\n\n

So it is necessary to know to some extent how different deposition methods affect film quality and properties.<\/p>\n\n\n\n

Please refer to the list of deposition methods here.<\/p>\n\n\n\n


of film How to make<\/th>		detail<\/th><\/tr><\/thead>

evaporation method

<\/td>
This technique forms thin films by evaporating deposition materials such as metals and oxides in a vacuumed container and deposits them on the surfaces of opposing substrates.
References\u203b1.2.3.4<\/td><\/tr>

Ion plating (IP) method<\/td>		In principle, it is almost identical to the evaporation method, but in this method, the evaporation material is ionized by passing the evaporation particles through plasma.

A negative voltage is applied to the substrate to be deposited and the ionized deposition material is accelerated to impact the substrate to form a thin film.

Ionization and acceleration can create highly adherent films.

References\u203b1.5<\/td><\/tr>

Sputtering method

<\/td>		Ions (usually Ar+ ions) created in the plasma by the discharge strike a plate (target) of the deposition material and splash the material.

This is a method whereby the flung deposition material flies to the substrate to form a thin film.

The sputtering method can be used for a wide range of deposition materials, such as metals and alloys with high melting points, which are difficult to deposit in case of vapor deposition method.

References\u203b1.5.6<\/td><\/tr>

Chemical vapor deposition (CVD) method

<\/td>		A method whereby gases containing the elements to be deposited are pumped onto the surface of a substrate and the films are deposited through chemical reactions and decomposition.

There are different types of CVD, including thermal CVD, where the substrate is heated, and plasma CVD, where the reaction tube is depressurized and plasma is generated.

References\u203b1.7.8<\/td><\/tr>

Atomic layer deposition (ALD) method<\/td>
Although said to be a type of CVD, atomic layer deposition (ALD) is a method in which two or more types of raw material gases (precursor, precursor) are alternately introduced and exhausted to form a film by reacting the adsorbed raw material molecules on the surface of the deposited film.

references\u203b8<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n