We are pleased to announce the release of a new video on Sugino Seisakusho\u2019s official YouTube channel!<\/p>\n
In this video, we take a closer look at an experiment in which alumina (Al\u2082O\u2083) was deposited onto copper powder using the SAL1000B desktop ALD system. We explain the mechanism behind the improved hydrophilicity and examine the powder\u2019s reaction with dilute nitric acid.<\/p>\n
In the previous experiment, the alumina-coated copper powder sank more readily in water, and there was a noticeable delay before it began to dissolve in dilute nitric acid. However, even after 500 ALD cycles, the coating could not completely prevent the copper from dissolving.<\/p>\n
Why did the surface become more hydrophilic? And why couldn\u2019t the alumina film completely prevent the reaction with dilute nitric acid? In this video, we revisit the experimental results and explore the answers from a chemical perspective.<\/p>\n
[What You\u2019ll Learn in This Video]<\/p>\n
\u30fbThe mechanism behind ALD-induced hydrophilicity and why copper powder sinks more readily in water
\n\u30fbWhy 500 ALD cycles were not enough to fully protect the copper
\n\u30fbThe properties of alumina and its reaction with dilute nitric acid, explained through chemical equations
\n\u30fbThe potential for improving acid resistance by using alternative materials, such as titanium oxide and hafnium oxide<\/p>\n
If you are interested in ALD coating of powders, surface modification, or the chemical resistance of thin films, be sure to watch the video!<\/p>\n