{"id":5562,"date":"2026-11-06T10:03:37","date_gmt":"2026-11-06T01:03:37","guid":{"rendered":"https:\/\/agus.co.jp\/en\/?p=5562"},"modified":"2026-11-06T10:03:37","modified_gmt":"2026-11-06T01:03:37","slug":"new-video-why-the-front-end-process-alone-isnt-enough-explaining-the-6-steps-of-semiconductor-back-end-processing","status":"publish","type":"post","link":"https:\/\/agus.co.jp\/en\/?p=5562","title":{"rendered":"[New Video] Why the Front-End Process Alone Isn\u2019t Enough! Explaining the 6 Steps of Semiconductor Back-End Processing"},"content":{"rendered":"

We\u2019ve released a new video on Sugino Seisakusho\u2019s official YouTube channel!<\/p>\n

In our previous videos, we explored the semiconductor front-end process, including etching and sputtering, which create ultra-fine circuits on silicon wafers at the nanometer scale.<\/p>\n

However, even after the front-end process is complete, the chips on the wafer are not yet ready to be used in smartphones or computers. The delicate circuits need to be protected, electrical connections must be made, and a protective outer package must be added.<\/p>\n

In this video, we take a closer look at the back-end process\u2014the essential steps that transform a completed wafer into the familiar black, square semiconductor devices we see in everyday life.<\/p>\n

Using a typical wire-bonded, resin-encapsulated package as an example, we explain the overall process in six steps.<\/p>\n

[Key Highlights]<\/p>\n