ALD EquipmentThis equipment is the system suitable for laboratory use to realize the precise step coverage deposition for uniform coating of each atomic layers.
An affordable ALD equipment
The deposition is easily possible every atomic layers
- User friendly
- With minimal configuration to deposit one kind of film
- Deposition test available with the demo system
Outer dimension (Main unit)
This model was developed for R&D.
This equipment is the system suitable for laboratory use to realize the precise step coverage deposition for uniform coating of each atomic layers.
The sample film kinds stipulated herein are just for the reference purpose only.
【Features1】Deposition distribution with higher quality
Deposition performance is ≦±3% within Φ100mmarea.
The pin hole free layer deposition can be evenly performed for each atomics on the substrate surface.
The deposition for uneven surface or 3D shape can be suitable due to its step coverage.
The substrate can be easily placed by lifting up the hatch at the upper side of the system on the substrate holder.
Operation buttons for exhaust and valves for gas flow adjustment are placed on the front panel.
4″ wafer placed
Operation button for Depo and Vent
【Features3】Easy software operation even on a small display
The screen layout has been designed so that the deposition status can be easily recognized. Pressure trend graph, Pressure, No.of deposition cycle, remaining No. of deposition cycle, Gas flow and Heater temperature can be read. Other items needed for a system operation and maintenance can be easily read as well.
【Features4】Substrate Rotation Function
The substrate rotation function is available as an option. Various experiments can be done by this function.
A big handle is attached on the side of the system to easily move from the installation place to another place. It weights 50kg and it should be moved by more than two persons.
SAL1000 Outer dimension
The following optional items are available.
【Feature1】Substrate Rotation Mechanism
Substrate Rotation Mechanism can be installed.
This generator can be used instead of H2O to make Oxygen atoms react to make a thin film. The vacuum time can be reduced without H2O and the deposition can be made at the low temperature as well.
【Feature3】Exhaust Gas Treatment Unit
The precursor gas exhausted by ALD can be decomposed at high temperature heating. The effect can be obtained if the flow is within a range.
【Feature4】Dry Vacuum Pump
The rotary pump can be replaced with Dry pump.
The dry pump is basically required if a system is installed in a clean room.
N2 gas introduction is recommended for a long life of a system, depending on process conditions.
【Feature5】Heater for Precursor
The jacket heater for precursors (Standard Max. 150℃) is available to maintain steady vaporization of a precursor within a bottle. The jacket heater for precursor (Max.200℃) is available as well.
A thermocouple can control the heater setting temperature and actual temperature of precursor on the operation panel.
Please contact us for repair and modification of our systems.