Advanced Sputtering System for PowderSputtering equipment is a PVD-type thin film forming equipment that utilizes the sputtering phenomenon in which ionized Ar gas under plasma discharge collides with a target at high speed, and target atoms ejected by the collision are deposited on the substrate.
SSP1500B
Compact tabletop parallel plate magnetron sputtering system for powder
POINT
- Equipped with a slant-rotating sample holder
- It is capable of film deposition while stirring powders
Outer dimensions (Main unit)
W385mm × D438mm × H635mm
| Cathode | Substrate heater | Combination |
|---|---|---|
| 1 piece | Not Applicable | × |