SSP1000
Desk－Top model as a low end model and it can select the deposition direction.
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This is a film deposition system that utilizes the sputtering phenomenon in which Ar ions collide with the target under plasma discharge, and the target material ejected by the collision are deposited on the substrate as a film.
As a related matter, we also introduce Annealing equipment to enhance the quality of the film after the deposition process.
Desk－Top model as a low end model and it can select the deposition direction.
Expandable Dual-cathode slim tower
Dual cathode model with glove box. Auto-matcher is standard.
Triple cathode, substrate heating MAX800 ℃, film thickness distribution ± 3%
Triple cathode, substrate heating up to Max.800℃, film thickness distribution ±3%, Expandable type.
Pressure control during heat treatment (annealing) to the substrate and heat treatment by introducing inert gas is possible.
The temperature control of Max.1000deg.C is achievable and RF power source can be equipped with and the combination with other systems can be possible.
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