We’ve released a new video on Sugino Seisakusho’s official YouTube channel!
In our previous videos, we explored the semiconductor front-end process, including etching and sputtering, which create ultra-fine circuits on silicon wafers at the nanometer scale.
However, even after the front-end process is complete, the chips on the wafer are not yet ready to be used in smartphones or computers. The delicate circuits need to be protected, electrical connections must be made, and a protective outer package must be added.
In this video, we take a closer look at the back-end process—the essential steps that transform a completed wafer into the familiar black, square semiconductor devices we see in everyday life.
Using a typical wire-bonded, resin-encapsulated package as an example, we explain the overall process in six steps.
[Key Highlights]
- Back Grinding: Grinding the back of the wafer to reduce its thickness to just a few dozen micrometers
- Dicing: Cutting the wafer into individual chips with high precision while minimizing chipping and cracking
- Die Attach: Securely mounting each chip onto a metal lead frame or substrate
- Wire Bonding: Connecting the chip’s microscopic circuits to external terminals using ultra-fine metal wires
- Molding: Encapsulating the chip and wires in protective resin
- Testing: Checking electrical performance and verifying that the finished semiconductor operates as designed
The familiar black semiconductor components we see every day are actually packages that protect the delicate circuits inside. Discover how the microscopic circuits created during the front-end process are transformed into finished products.
In our next videos, we’ll take a closer look at two particularly precision-intensive back-end processes: dicing and wire bonding.
If you’re interested in semiconductor manufacturing and processing technologies, be sure to watch the video!
▼ Watch the video here:
https://www.youtube.com/watch?v=yfpIoDMvRsA
