We have released a new video on Suga Seisakusho’s official YouTube channel!
In this video, we use Suga Seisakusho’s Cubic Sputtering System “SSP1000” to demonstrate titanium sputter deposition onto alumina powder.
Unlike conventional sputter deposition, where a substrate such as a wafer is fixed in place, coating powder requires the powder to be moved during the process in order to achieve a more uniform coating.
In this experiment, alumina powder is placed in a dish and rotated at an angle while knocking and vibration mechanisms are used to keep the powder moving as titanium is deposited.
The video shows the entire process, from creating a vacuum and pre-sputtering to 30 minutes of deposition and inspection of the powder after coating.
[Highlights of This Video]
・Titanium deposition onto alumina powder using the SSP1000
・Knocking and vibration mechanisms for moving the powder
・The process from vacuum evacuation and pre-sputtering to deposition
・Changes in the powder after 30 minutes of deposition
・Comparison of the powder before and after coating
・Introduction of the powder-specific sputtering system “SSP1500B”
In this experiment, 9.00 g of alumina powder was coated with titanium for 30 minutes, resulting in powder with a relatively uniform metallic luster.
We also introduce the “SSP1500B,” a powder-specific sputtering system incorporating rotation, agitation, and vibration mechanisms developed through this type of testing to make sputter deposition onto powder easier.
If you are interested in sputter deposition onto powder or are considering a sputtering system for powder applications, be sure to check out the video!
▼Watch the video here
