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As it has been well discussed, SPS has many advantages. It can produce good quality sintering compacts that could not be achieved by the conventional

TiN is commonly deposited for semiconductors as the barrier layer in between Oxide film layer (SiO2, etc.) and Cupper to prevent the integration.

SPS has the following notable features on its structural and heating mechanism. (1) Pressure sintering that applies heat and pressure at the same

Spark Plasma Sintering (SPS): Next-gen material synthesis technology SUGA Co., Ltd. / Sales Division SPS (Spark Plasma Sintering) is the next-gen