Film deposition of TiN using SUGA’s desk-to…
TiN is commonly deposited for semiconductors as the barrier layer in between Oxide film layer (SiO2, etc.) and Cupper to prevent the integration.
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Features of SPS (Spark Plasma Sintering) te…
SPS has the following notable features on its structural and heating mechanism. (1) Pressure sintering that applies heat and pressure at the same
Introduction of Spark Plasma Sintering (SPS…
Spark Plasma Sintering (SPS): Next-gen material synthesis technology SUGA Co., Ltd. / Sales Division SPS (Spark Plasma Sintering) is the next-gen
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