Sputtering Equipment

High-temperature heat treatment and gas replacement for substrates are possible. SAN2000Plus is capable of plasma processing.

  • SAN1000

    Pressure control during heat treatment (annealing) to the substrate and heat treatment by introducing inert gas is possible.

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  • SAN2000Plus

    The temperature control of Max.1000deg.C is achievable and RF power source can be equipped with and the combination with other systems can be possible.

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